Specialty Labels
High‑Temperature PI Label (260°C+) – Reflow Soldering Compatible
Premium polyimide (PI) label designed to withstand lead‑free reflow soldering temperatures up to 260°C (500°F). Amber colored, ultra‑thin, and highly adhesive – ensures traceable barcodes on PCBs through multiple thermal cycles.
Specifications
- Material
- Polyimide (PI) film
- Color
- Amber (translucent) / white on request
- Standard sizes
- Custom die‑cut from 3mm x 3mm to 100mm x 50mm
- Core diameter
- 1 inch or 3 inch
Detailed Specifications
Material | Polyimide (PI) film |
Color | Amber (translucent) / white on request |
Adhesive | High‑temperature silicone / acrylic (260°C+ rated) |
Temperature range | -70°C to +300°C (peak 340°C for short duration) |
Standard sizes | Custom die‑cut from 3mm x 3mm to 100mm x 50mm |
Core diameter | 1 inch or 3 inch |
Print compatibility | Thermal transfer (resin ribbon only) |
Custom shapes, printed text, and sequential barcodes available. White PI label also offered.
Key Features
- Reflow soldering proof – Withstands 260°C peak temperature for multiple thermal cycles without delamination, discoloration, or adhesive bleed.
- Ultra‑thin construction – 25–50 micron thickness minimizes interference with component placement and reflow airflow.
- Excellent chemical resistance – Resists flux residues, cleaning solvents, and mild acids after soldering.
- High‑temperature adhesive – Silicone‑based adhesive maintains bond strength during extreme heat and remains intact after cooling.
- Barcode readability – Resin ribbon imprint stays sharp and scannable after reflow and subsequent handling.
- UL recognized option – Available with UL certification for electronic component identification.
Applications
Use High‑Temperature PI Label for:
- PCB assembly & SMT – Traceability labels on bare boards before, during, and after lead‑free reflow soldering.
- IC & component packaging – Carrier tape labels, reel identification, and tray labels that go through baking cycles.
- Motor & transformer insulation – Winding labels that withstand varnish baking and high operating temperatures.
- Battery cells – Labels on lithium‑ion cells that tolerate formation and aging test temperatures.
- Aerospace & automotive electronics – Under‑hood modules, engine control units (ECUs), and high‑reliability assemblies.
For less demanding heat applications (≤150°C), PET labels are a lower‑cost alternative.
Printer & Ribbon Compatibility
Recommended ribbons:
- Resin ribbon (high‑energy) – Mandatory for PI labels. Wax/resin ribbons will not transfer properly; print will wipe off.
- Best choices: Premium resin ribbons formulated for PI or high‑temperature polyester.
Compatible printers:
Most industrial thermal transfer printers from Zebra (ZT series, ZQ series), Honeywell (PD45, PM45), Sato (CL, GL), TSC (Alpha, MH). Desktop printers may lack the energy to print on PI – test first.
Printer settings suggestion:
- Darkness: 28–35% (max recommended for printhead)
- Speed: 1–3 inches per second (ips) to ensure complete transfer onto the rough PI surface.
⚠️ Important: PI labels require a ribbon that is at least as wide as the label to avoid printhead contact with abrasive PI material. Always use resin ribbon.
How to Choose the Right Label Size & Quantity
- Size: Custom die‑cut down to 3mm x 3mm for tiny PCB tracking labels.
- Roll length: Typically 250–1000 labels per roll based on label size.
- Core: 1 inch (standard) for Zebra/Honeywell; 0.5 inch for some desktop printers (not recommended for PI).
- Orientation: Inside‑out winding (print side out) – standard for most printers.
Ordering & Sample Information
- MOQ: 50 roll for standard blank labels (custom die‑cut shapes – MOQ 100 rolls).
- Free sample: 5–10 pieces available for testing. Requires resin ribbon – we can provide matching ribbon sample.
- Custom printing: Logo, 1D/2D barcode, or serialized numbers – MOQ 2000 pcs.
- Lead time:
- Blank labels (stock sizes): 3–5 business days
- Custom die‑cut or printed: 10–15 business days
- Large volume (>500 rolls): 20–25 days
