



Polyimide Label Manufacturer – PCB High Temperature Labels for Reflow Soldering
As a professional polyimide label manufacturer, we produce PCB high temperature labels engineered to survive lead‑free reflow soldering at 260°C+. Our polyimide (PI) labels deliver reliable barcode readability and adhesion through multiple thermal cycles, ensuring traceability in PCB assembly and SMT production lines.
Specifications
- Material
- Polyimide (PI) film
- Color
- Amber (translucent) / white on request
- Standard sizes
- Custom die‑cut from 3mm x 3mm to 100mm x 50mm
- Core diameter
- 1 inch or 3 inch
Detailed Specifications
Material | Polyimide (PI) film |
Color | Amber (translucent) / white on request |
Adhesive | High‑temperature silicone / acrylic (260°C+ rated) |
Temperature range | -70°C to +300°C (peak 340°C for short duration) |
Standard sizes | Custom die‑cut from 3mm x 3mm to 100mm x 50mm |
Core diameter | 1 inch or 3 inch |
Print compatibility | Thermal transfer (resin ribbon only) |
Key Features
- Reflow soldering proof – Withstands 260°C peak temperature for multiple thermal cycles without delamination, discoloration, or adhesive bleed.
- Ultra‑thin construction – 25–50 micron thickness minimizes interference with component placement and reflow airflow.
- Excellent chemical resistance – Resists flux residues, cleaning solvents, and mild acids after soldering.
- High‑temperature adhesive – Silicone‑based adhesive maintains bond strength during extreme heat and remains intact after cooling.
- Barcode readability – Resin ribbon imprint stays sharp and scannable after reflow and subsequent handling.
- UL recognized option – Available with UL certification for electronic component identification.
- Manufactured in‑house – Consistent coating quality, batch traceability, and direct factory support as a dedicated polyimide label manufacturer for PCB high temperature labels.
Applications
- PCB assembly & SMT – Traceability labels on bare boards before, during, and after lead‑free reflow soldering.
- IC & component packaging – Carrier tape labels, reel identification, and tray labels that go through baking cycles.
- Motor & transformer insulation – Winding labels that withstand varnish baking and high operating temperatures.
- Battery cells – Labels on lithium‑ion cells that tolerate formation and aging test temperatures.
- Aerospace & automotive electronics – Under‑hood modules, engine control units (ECUs), and high‑reliability assemblies.
For less demanding heat applications (≤150°C), PET labels are a lower‑cost alternative.
Printer & Ribbon Compatibility
Recommended ribbons:
- Resin ribbon (high‑energy) – Mandatory for PI labels. Wax/resin ribbons will not transfer properly; print will wipe off.
- Best choices: Premium resin ribbons formulated for PI or high‑temperature polyester.
Compatible printers:
Printer settings suggestion:
- Darkness: 28–35% (max recommended for printhead)
- Speed: 1–3 inches per second (ips) to ensure complete transfer onto the rough PI surface.
⚠️ Important: PI labels require a ribbon that is at least as wide as the label to avoid printhead contact with abrasive PI material. Always use resin ribbon.
How to Choose the Right Polyimide Label
1. Temperature rating
- 260°C+ (continuous) – Standard for lead‑free reflow
- 300°C+ (peak) – For short‑duration exposure
- Always match the label’s rated temperature to your reflow profile peak.
2. Size & thickness
- Thickness: 25–50µm – ultra‑thin to avoid interfering with component placement
- Size: Custom die‑cut from 3mm x 3mm to 100mm x 50mm – specify your PCB space constraints
3. Adhesive type
- Silicone‑based – Recommended for 260°C+ reflow
- Modified acrylic – For lower temperature applications (<200°C)
- Always verify adhesive compatibility with your reflow profile.
4. Printer & ribbon settings
- Ribbon: Resin ribbon only (wax/resin will fail)
- Darkness: 28–35% – higher than standard PET
- Speed: 1–3 inches per second (ips) for complete transfer
⚠️ Note: PI labels require a ribbon that is at least as wide as the label to avoid printhead contact with abrasive PI material. Always use resin ribbon.
Ordering & Sample Information
- MOQ: 50 roll for standard blank labels (custom die‑cut shapes – MOQ 100 rolls).
- Free sample: 5–10 pieces available for testing. Requires resin ribbon – we can provide matching ribbon sample.
- Custom printing: Logo, 1D/2D barcode, or serialized numbers – MOQ 2000 pcs.
- Lead time:
- Blank labels (stock sizes): 3–5 business days
- Custom die‑cut or printed: 10–15 business days
- Large volume (>500 rolls): 20–25 days
🏭 | Polyimide Label Manufacturer – Direct factory pricing and quality control |
🔥 | PCB High Temperature Labels – Tested for 260°C+ reflow soldering |
📦 | Batch Traceability – Every roll logged from coating to slitting |
✅ | RoHS & REACH Compliant – Certified for electronics manufacturing |



