Reflow soldering heat
Standard labels burn or delaminate at 260°C+ lead‑free reflow temperatures. Our polyimide (PI) labels remain intact, with legible barcodes after multiple thermal cycles.
ELECTRONICS & PCB ASSEMBLY
Find polyimide (PI) labels that survive 260°C lead-free soldering, anti-static ESD options for clean rooms, and matched resin ribbons for durable, scannable barcodes.
The challenges we solve for PCB assembly and clean rooms.
Standard labels burn or delaminate at 260°C+ lead‑free reflow temperatures. Our polyimide (PI) labels remain intact, with legible barcodes after multiple thermal cycles.
Static‑sensitive components require labels that do not generate or trap charge. Our anti‑static ESD labels are dissipative and clean‑room compatible.
PCB labels often need to fit tight spaces while carrying readable 2D codes or text. We offer ultra‑thin materials and precision die‑cutting down to 3mm.
Residues from flux removers, alcohol, or other solvents can wipe out ordinary ink. Our resin ribbons and over‑laminated labels resist smearing and adhesion loss.
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